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Press Release / Business / 3D IC Market 2017 Comprehensive Analysis and Future Estimations 2023

3D IC Market 2017 Comprehensive Analysis and Future Estimations 2023

By Akash Sangshetti on February 05 2018 | 179 Views

Market Research Future published a research report on “3D IC Market Research Report- Global Forecast to 2022” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.

Market Scenario

The growing semiconductor & microelectronics industry is developing a trend for vertically stacked integrated circuits (ICs) which is emerging as viable solution for providing high performance, increased functionality and reducing power consumption to fulfill electronic device requirements. These ICs are in great demand by military & aerospace, medical and consumer electronics industries to fulfill need of integrating disparate technologies which includes logic, memory, RF, sensor in small forms for industrial applications.

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One of the emerging trend in the semiconductor industry is 3D packaging using through silicon vias (TSVs) technology. This emerging trend is being driven by need of improving performance and to reduce timing delays. Low cost, high aspect ratio, reliable via formation & filling technologies are the need of today’s semiconductor industry. As functional integration requirement increases, assembly and wafer fabrication companies are looking for 3D TSV technology.

The major factor that drives the growth of 3D IC market is growing increasing demand for advanced electronic products which is driving semiconductor industry to innovate new packaging technology and high demand for 3D packaging using TSVs are major factors driving market growth of 3D ICs during forecast period.

Target Audience:

Consumer electronics vendors
Data center service providers
Communication industries
Research and consulting firms
Small and large enterprises
Government agencies
Segments for 3D IC Market:

Global 3D IC Market can be segmented as follows:

Segmentation by Technology: type (3D stacked ICs and monolithic 3D ICs) and packaging & integration (3D system- in-package (Sip), 3D wafer level packaging (WLP), 2.5D & 3D interposing, and 3D heterogeneous integration.
Segmentation by Components: through silicon vias (TSVs), through glass vias (TGVs), and others.
Segmentation by Products: CMOS image sensors (CIS), 3D memory, MEMS & sensors, and light emitting diodes.
Segmentation by Application: IT/telecommunication, consumer electronics, industrial, aerospace & defense, automotive, medical and others.
Key Players:

Some of the major players in Global 3D IC Market include Xilinx Inc., Tezzaron Semiconductor Corporation, and BeSang Inc., Monolithic 3D Inc., United Microelectronics Corporation, 3M Company, Intel Corporation, and, IBM Corporation.

Key Findings

Globally 3D ICs market is expected to grow with 17% CAGR during 2016-2022.
By type, 3D stacked IC is dominating the market whereas monolithic 3D IC is expected to be the fastest growing segment with approximately 20% CAGR during forecast period 2016-2022.
Through silicon vias (TSVs) are projected to grow with approximately 19% CAGR
Geographically, Asia-Pacific is dominating the 3D ICs market and expected to grow with 17% CAGR whereas North America is projected to be the fastest growing market
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Regional Analysis:

Asia-Pacific is dominating the Global 3D IC market with the largest market share due to emerging demand from growing consumer electronics market in the region and therefore is expected to grow with highest revenue by 2022. North-America is expected to grow as a second highest market after Asia-Pacific in the forecast period due to increasing demand of ICs in U.S. and Canada region.

TABLE OF CONTENTS

1 EXECUTIVE SUMMARY

2 MARKET DYNAMICS

2.1 Market Drivers

2.2 Market Challenges

2.3 3D ICs Supply Chain

2.4 Porter’s Five Forces Analysis

3 GLOBAL 3D ICS MARKET, BY TECHNOLOGY

3.1 3D IC Technology Type Market

3.1.1 Market By Sub-Segment

3.1.1.1 3D Stacked ICs

3.1.1.2 Monolithic 3D ICs

3.2 3D IC Packaging & Integration Type

3.2.1.1 3D System In Package (3D Sip)

3.2.1.2 3D Wafer Level Package (3D WLP)

3.2.1.3 2.5D & 3D Interposer

3.2.1.4 3D Heterogeneous Integration

4 GLOBAL 3D IC MARKET, BY COMPONENT

4.1 Introduction

4.2 Market By Sub-Segment

4.2.1 Through Silicon Vias (TSVs)

4.2.2 Through Glass Vias (TGVs)

5 GLOBAL 3D IC MARKET, BY PRODUCTS

5.1 Introduction

5.2 Market By Sub-Segment

5.2.1 CMOS Image Sensors

5.2.2 3D Memory

5.2.3 MEMS & Sensors

5.2.4 Light Emitting Diodes (LEDs)

6 GLOBAL 3D ICS MARKET, BY APPLICATIONS

6.1 Introduction

6.2 Market By Sub-Segment

6.2.1 IT/Telecommunications

6.2.2 Consumer Electronics

6.2.3 Industrial

6.2.4 Aerospace & Defence

6.2.5 Automotive

6.2.6 Medical

Continued…

About Us:

At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.

Media Contact:

Akash Anand,

Market Research Future

Office No. 528, Amanora Chambers

Magarpatta Road, Hadapsar,

Pune - 411028

Maharashtra, India

+1 646 845 9312

Email: akash.anand@marketresearchfuture.com



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